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用于电子器件的高速瞬态热仿真方法及系统
Release Time:2022-08-12
  • Institution:
    能源与动力工程学院
  • Scope of Patent:
    电子器件高速瞬态热仿真技术领域
  • School Sign:
    山东大学
  • Patent Description:
    本发明提供了一种用于电子器件的高速瞬态热仿真方法及系统，不仅可有效获取电子器件的高速瞬态温度变化，且避免了动态温度平衡前的超千万次周期的运算过程，极大程度降低了仿真时间和运算成本。
  • Type of Patent:
    发明
  • State of Patent:
    Authorized patents
  • Application Number:
    202210495680.3
  • Authorization Number:
    ZL 2002 1 0495689.3
  • Number of Inventors:
    5
  • Service Invention or Not:
    No
  • Application Date:
    2022-05-09
  • Publication Date:
    2022-07-22
  • Authorization Date:
    2022-07-22
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