Return Home
Paper Publications
Influence of Temperature and Current Stressing on Cu-Sn Intermetallic Compound Growth Characteristics of Lead-Free Microbump
Release Time:2023-12-07
  • Journal:
    Advanced Theory and Simulations
  • First Author:
    付志伟
  • Document Code:
    1637724144632020994
  • Volume:
    6
  • Issue:
    4
  • Number of Words:
    4
  • Translation or Not:
    No
  • Date of Publication:
    2023-02
Copyright All Rights Reserved Shandong University Address: No. 27 Shanda South Road, Jinan City, Shandong Province, China: 250100
Information desk: (86) - 0531-88395114
On Duty Telephone: (86) - 0531-88364731 Construction and Maintenance: Information Work Office of Shandong University