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High-Temperature Degradation Mechanism of Interfacial Thermal Resistance Based on Submicron Silver Adhesion
Release Time:2023-12-07
  • Journal:
    Advanced Materials Interfaces
  • First Author:
    王健
  • Document Code:
    1610220791983292418
  • Volume:
    10
  • Issue:
    4
  • Number of Words:
    4
  • Translation or Not:
    No
  • Date of Publication:
    2022-12
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