MAdtIA62NqShBYQV43Qa84B98KPTwwcf8nY4uOgOrWQUFrUZUYgiuwdA8p3M
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光电器件超精密装配封装技术研究及其成套装备研发与应用

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Project Name:光电器件超精密装配封装技术研究及其成套装备研发与应用

Institution:机械工程学院

Leading Scientist:姚鹏

Nature of Project:纵向

Project Number:15B9D716FFF02E03E063BE07C2CA9EC0

Project Approval Number:2023CXGC010207-1

Date of Project Approval:2023-07-01

Scheduled Completion Time:2026-06-30

Date of Project Completion:2026-06-30

Date of Project Initiation:2023-07-01

Release Time:2024-05-09

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