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Title:一种搅拌摩擦焊接孔洞缺陷预测方法与系统
Institution:材料科学与工程学院
Type of Patent:Invent
Application Number:202210223412.6
Number of Inventors:2
Service Invention or Not:No
Application Date:2022-03-07
Publication Date:2023-02-03
Authorization Date:2023-02-03
Release Time:2023-05-20