Paper Publications
Influence of crystal orientation and incident plane on n-type 4H-SiC wafer slicing by using picosecond laser
Release Time:2024-12-20
  • Institution:
    新一代半导体材料研究院
  • Journal:
    Optics and Laser Technology
  • First Author:
    姚勇平
  • Document Code:
    764B6DD20F3D4C4E924F28801FA7D505
  • Issue:
    Volume182,PartB
  • Number of Words:
    5
  • Translation or Not:
    No
  • Date of Publication:
    2024-11
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