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Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing
Release Time:2023-12-07
  • Journal:
    Materials
  • First Author:
    付志伟
  • Document Code:
    1637724144460054529
  • Volume:
    16
  • Issue:
    3
  • Number of Words:
    4
  • Translation or Not:
    No
  • Date of Publication:
    2023-02
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