Project Name:集成电路封装标准化研究
Institution:集成电路学院
Leading Scientist:王卿璞
Nature of Project:横向
Project Number:D3CA254DB7CC4BBDE053BE07C2CA3E3D
Date of Project Approval:2021-12-16
Scheduled Completion Time:2022-12-16
Date of Project Completion:2022-12-16
Date of Project Initiation:2021-12-16
Release Time:2022-05-27