集成电路芯片封装课程产教融合教学模式研究
Release Time:2025-04-08
Hits:
- Institution:
- 集成电路学院
- Title of Paper:
- 集成电路芯片封装课程产教融合教学模式研究
- Journal:
- 教育理论与研究
- First Author:
- 李虎
- Document Code:
- 73ABCE03EDCC4D208D66230B6E8C5BD1
- Volume:
- 2
- Issue:
- 23
- Number of Words:
- 5
- Translation or Not:
- No
- Date of Publication:
- 2024-12
- Release Time:
- 2025-04-08