Yifei Philip Zhang
Professor
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基于柔性薄膜的6G太赫兹芯片与三维电路集成的研究
  • Project Name:
    基于柔性薄膜的6G太赫兹芯片与三维电路集成的研究
  • Institution:
    集成电路学院
  • Leading Scientist:
    张翼飞
  • Nature of Project:
    纵向
  • Project Level:
    省、部委级
  • Project Number:
    1BB28A0F56363FC6E063BE07C2CA33FE
  • Project Approval Number:
    ZR2023ZD08-1
  • Date of Project Approval:
    2024-01-01
  • Scheduled Completion Time:
    2026-12-31
  • Date of Project Completion:
    2026-12-31
  • Date of Project Initiation:
    2024-01-01
  • Release Time:
    2024-08-02
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